Impact of Assembly Cycles on Copper Wrap Plating

Published:

July 22, 2020

Author:

Hardeep Heer, Ryan Wong, et al

Abstract:

The PWB industry needs to complete reliability testing in order to define the minimum copper wrap plating thickness requirement for confirming the reliability of PTH structures. Predicting reliability must ensure that the failure mechanism is demonstrated as a wear-out failure mode because a plating wrap failure is unpredictable. The purpose of this study was to quantify the effects of various copper wrap plating thicknesses through IST testing followed by micro sectioning to determine the failure mechanism and identify the minimum copper wrap thickness required for a reliable PWB. Minimum copper wrap plating thickness has become an even a bigger concern since designers started designing HDI products with buried vias, microvias and through filled vias all in one design. PWBs go through multiple plating cycles requiring planarization after each plating cycle to keep the surface copper to a manageable thickness for etching. The companies started a project to study the relationship between Copper wrap plating thickness and via reliability. The project had two phases. This paper will present findings from both Phase 1 and Phase 2....

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Company Information:

Firan Technology Group

FTG is a leading North American manufacturer of high technology printed circuit boards and precision illuminated display systems.

Toronto, Ontario, Canada

Contract Manufacturer, Manufacturer of Assembled PCBs, Service Provider

  • Phone (416) 299 - 4000
  • Fax (416) 292 - 4308

Firan Technology Group website

Company Postings:

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