Silicone Thermally Conductive Grease: Improving Thermal Management of Electronic Assemblies
Published: |
September 30, 2020 |
Author: |
Carlos Montemayor |
Abstract: |
Introduction •Market trend: Smaller, more efficient, more powerful, run faster •ICs and other sophisticated electronic components typically operate efficiently only under a certain range of temperatures •Operational temperatures must be kept within a suitable range • Excessive heat can damage performance and can even cause system failure... |
|
More SMT / PCB assembly technical articles »
- Dec 07, 2020 - A Non-destructive Approach to Identify Intermittent Failure Locations on Printed Circuit Cards (PCC) that have been Temperature Cycle Tested | ACI Technologies, Inc.
- Dec 02, 2020 - SMT007-MIRTEC Intelligent Factory Automation Article-November 2020 | MIRTEC Corp
- Nov 09, 2020 - Ball Grid Array (BGA) Voiding Affecting Functionality | ACI Technologies, Inc.
- Nov 04, 2020 - WHY CLEAN A NO-CLEAN FLUX | KYZEN Corporation
- Nov 04, 2020 - Higher Defluxing Temperature and Low Standoff Component Cleaning - A Connection? | ZESTRON Americas
- Browse Technical Library »
Silicone Thermally Conductive Grease: Improving Thermal Management of Electronic Assemblies article has been viewed 142 times
dmullins
October 1, 2020
Not what I was expecting. They tested one product and found problems with it, then concluded that heat sink compound is important.