Interconnect Reliability Correlation with System Design and Transportation Stress

Published:

October 18, 2020

Author:

Dr. Paul Wang, Vincent Weng, and Dr. Kim Sang Chim

Abstract:

Interconnect reliability especially in BGA solder joints and compliant pins are subjected to design parameters which are very critical to ensure product performance at pre-defined shipping condition and user environment. Plating thickness of compliant pin and damping mechanism of electronic system design are key successful factors for this purpose. In additional transportation and material handling process of a computer server system will be affected by shock under certain conditions. Many accessories devices in the server computer system tend to become loose resulting in poor contact or solder intermittent interconnect problems due to the shock load from the transportation and material handling processes....

  • Download Interconnect Reliability Correlation with System Design and Transportation Stress article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

MiTAC International Corporation

MiTAC Holdings Group has been developing into a multinational organization of JDM / ODM / OEM / OPM (Original Product Manufacture), design and R&D, manufacturing, testing, assembling, marketing, and servicing in around four decade

Taoyuan City, Taiwan

OEM

  • Phone +886-3-3289000

MiTAC International Corporation website

Company Postings:

(1) technical library article

  • Nov 09, 2020 - Ball Grid Array (BGA) Voiding Affecting Functionality | ACI Technologies, Inc.
  • Nov 04, 2020 - WHY CLEAN A NO-CLEAN FLUX | KYZEN Corporation
  • Nov 04, 2020 - Higher Defluxing Temperature and Low Standoff Component Cleaning - A Connection? | ZESTRON Americas
  • Sep 02, 2020 - Reworking ALD Coatings | ACI Technologies, Inc.
  • Aug 05, 2020 - ALD of Alumina Ceramic Films for Hermetic Protection | ACI Technologies, Inc.
  • Browse Technical Library »

Interconnect Reliability Correlation with System Design and Transportation Stress article has been viewed 111 times

 Reflow System

Small Parts Tips