Comparing Soldering Results of ENIG and EPIG Post Steam Exposure

Published:

November 15, 2020

Author:

J. Bengston and R. DePoto Uyemura International

Abstract:

ENIG, electroless nickel immersion gold is now a well-regarded finish used to enhance and preserve the solder-ability of copper circuits. EPIG, electroless palladium immersion gold, is a new surface finish also for enhancing and preserving solder-ability but with the advantage of eliminating Electroless Nickel from the deposit layer. This feature has become increasingly important with the increasing use of high frequeny PWB designs whereby nickel's magnetic properties are detrimental. We examine these two finishes and their respective soldering characteristics as plated and after steam aging and offer an explanation for the performance deviation....

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Company Information:

Uyemura International Corporation

Ontario, , California, USA

  • Phone 909-466-5635

Uyemura International Corporation website

Company Postings:

(1) technical library article

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