How to Manage Material Outgassing in Reflow Oven

Published:

November 24, 2020

Author:

Gerjan Diepstraten

Abstract:

In a lead-free reflow process, temperatures are higher, and materials use outgasses more than in a leaded reflow process. The trends toward higher density populated boards and more pin-in-paste technology also increase solder paste use. More components and more solder paste result in more outgassing of chemistry during the reflow process. Some assemblies report condensation of vapors when the cold printed circuit board enters the oven. Little is known about the interaction between these condensed materials in terms of the interaction between these condensed materials and the reliability of the assembly. Apart from the question of reliability, a printed circuit board contaminated with a small film of residues after reflow soldering is not desirable....

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Company Information:

Vitronics Soltec

Global manufacturer of XPM Reflow Ovens, ZEVA Selective Soldering and Delta Wave Soldering Equipment.

Camdenton, Missouri, USA

Manufacturer of Assembly Equipment, Selective Soldering, Soldering

  • Phone +1-573-317-3008

Vitronics Soltec website

Company Postings:

(7) products in the catalog

(7) technical library articles

(12) news releases

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