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Stress Analysis and Optimization of a Flip Chip on Flex Electronic Packaging Method for Functional Electronic Textiles

Published:

December 24, 2020

Author:

englong Li , John Tudor, Russel Torah, and Steve Beeby, Senior Member, IEEE

Abstract:

A method for packaging integrated circuit silicon die in thin flexible circuits has been investigated that enables circuits to be subsequently integrated within textile yarns. This paper presents an investigation into the required materials and component dimensions in order to maximize the reliability of the packaging method. Two die sizes of 3.5 mm×8 mm× 0.53 mm and 2 mm×2 mm×0.1 mm have been simulated and evaluated experimentally under shear load and during bending. The shear and bending experimental results show good agreement with the simulation results and verify the simulated optimal thickness of the adhesive layer. Three underfill adhesives (EP30AO, EP37-3FLF, and Epo-Tek 301 2fl), three highly flexible adhesives (Loctite 4860, Loctite 480, and Loctite 4902), and three substrates (Kapton,Mylar, and PEEK) have been evaluated, and the optimal thickness of each is found. The Kapton substrate, together with the EP37-3FLF adhesive, was identified as the best materials combination with the optimum underfill and substrate thickness identified as 0.05 mm....

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Company Information:

University of Southampton

The University of Southampton is a research university in Southampton, England. The university's origins date back to the founding of the Hartley Institution in 1862. In 1902, the Institution developed into the Hartley University

Highfield, Southampton, United Kingdom

School

  • Phone +44 (0)23 8059 5000

University of Southampton website

Company Postings:

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