Fill the Void V - Mitigation of Voiding for Bottom Terminated Components

Published:

December 29, 2020

Author:

Tony Lentz, FCT Assembly & Greg Smith, BlueRing Stencils

Abstract:

Voiding in solder joints has been studied extensively, and the effects of many variables compared and contrasted with respect to voiding performance. Solder paste flux, solder powder size, stencil design, circuit board design, via-in-pad design, surface finish, component size, reflow profile, vacuum reflow, nitrogen reflow and other parameters have been varied and voiding quantified for each. The results show some differences in voiding performance with respect to most of these variables but these variables are not independent of each other. Voiding in solder joints is a complex issue that often requires multiple approaches to reduce voiding below required limits. This paper focuses on solutions to voiding for commonly used bottom terminated components (BTCs)....

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Company Information:

FCT ASSEMBLY, INC.

With numerous facilities in the United States, we are one of the electronics industry's leading manufacturers of lead-free solder products, superior quality stencils, and precision cut parts.

Greeley, Colorado, USA

Manufacturer of Assembly Material, Soldering

  • Phone 970-346-8002
  • Fax 970-346-8331

FCT ASSEMBLY, INC. website

Company Postings:

(14) products in the catalog

(14) technical library articles

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