D-PAK Voiding: A Study to Determine the Origins of D-PAK Voiding

Published:

December 29, 2020

Author:

Kim Flanagan and Greg Wade

Abstract:

Voiding in bottom termination components (BTCs) like QFNs and LGAs have become quote the hot topic in the SMT industry. Surprisingly, one type of BTC component that is observed to have excessive amounts of voiding is the DPAK. One would think that a component with leads located on only one side would mitigate flux entrapment and allow outgassing to escape more easily from beneath the component, as compared to other BTCs where the component is affixed to the PCB on two or more sides. However, the exact opposite has been observed in most cases....

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Company Information:

Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, USA

Manufacturer of Assembly Material, Soldering

  • Phone 315-853-4900
  • Fax 315-853-1000

Indium Corporation website

Company Postings:

(10) products in the catalog

(28) technical library articles

(309) news releases

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