Challenges of Manufacturing with Printed Circuit Board Cavities

Published:

January 6, 2021

Author:

William O. Alger, Pedro J. Martinez, Weston C. Roth

Abstract:

Cavity technology in a Printed Circuit Board (PCB) has existed for many years. The methodology to create the cavity in the PCB has evolved over time as technologies have advanced and the manufacturing process varies by the individual PCB...

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Company Information:

Intel Corporation

Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.

Santa Clara, California, USA

Manufacturer of Components

  • Phone (408) 765-8080

Intel Corporation website

Company Postings:

(32) technical library articles

(5) news releases

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  • Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
  • Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
  • Sep 02, 2021 - UV Laser PCB Depaneling Machine Improve Cutting Effect | Winsmart Electronic Co.,Ltd
  • Jun 28, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
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