Challenges of Manufacturing with Printed Circuit Board Cavities

Published:

January 6, 2021

Author:

William O. Alger, Pedro J. Martinez, Weston C. Roth

Abstract:

Cavity technology in a Printed Circuit Board (PCB) has existed for many years. The methodology to create the cavity in the PCB has evolved over time as technologies have advanced and the manufacturing process varies by the individual PCB...

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Company Information:

Intel Corporation

Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.

Santa Clara, California, USA

Manufacturer of Components

  • Phone (408) 765-8080

Intel Corporation website

Company Postings:

(31) technical library articles

(5) news releases

  • Dec 07, 2020 - A Non-destructive Approach to Identify Intermittent Failure Locations on Printed Circuit Cards (PCC) that have been Temperature Cycle Tested | ACI Technologies, Inc.
  • Dec 02, 2020 - SMT007-MIRTEC Intelligent Factory Automation Article-November 2020 | MIRTEC Corp
  • Nov 09, 2020 - Ball Grid Array (BGA) Voiding Affecting Functionality | ACI Technologies, Inc.
  • Nov 04, 2020 - WHY CLEAN A NO-CLEAN FLUX | KYZEN Corporation
  • Nov 04, 2020 - Higher Defluxing Temperature and Low Standoff Component Cleaning - A Connection? | ZESTRON Americas
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