Reliability Testing For Microvias In Printed Wire Boards

Published:

January 21, 2021

Author:

Bill Birch

Abstract:

Traditional single level microvia structures are generally considered the most robust type of interconnection within a printed wire board (PWB) substrate. The rapid implementation of HDI technology now commonly requires between 2, 3 or 4 levels of microvias sequentially processed into the product. Recent OEM funded reliability testing has confirmed that by increasing the levels (stack height) these structures are proving less reliable, when compared to their single or double level counterparts. Recently false positive results have been recorded on products tested with traditional thermal shock testing methodology (cycling between -40°C and 125°C, or 145°C). A number of companies are incurring product failures resulting in increased costs associated with replacing the circuit boards, components and added labour....

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Company Information:

PWB Interconnect Solutions Inc.

PWB Interconnect Systems Inc. is a Canadian company established in 1996. We design and manufacture test equipment and provide services to test the reliability of bare Printed Wiring/Circuit Boards (PWBs/PCBs). These products ...

Nepean, Ontario, Canada

Test Services

  • Phone (613) 596-4244

PWB Interconnect Solutions Inc. website

Company Postings:

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