Reliability of Stacked Microvia

Published:

January 21, 2021

Author:

Hardeep Heer & Ryan Wong

Abstract:

Reliability of Microvia has been a concern since microvias were introduced to our industry. This study was designed to understand the reliability of Type 1, Type 2, and Type 3 Microvias. Reliability Test Coupon design was developed in co-operation with PWB Interconnect to include up to four stacks of microvias placed on and off a buried via. Standard FR4 material, meeting the requirement of IPC-4101/24, was selected and IST thermal cycling was chosen as a reliability test method. Staggered microvias were not considered because previous testing has shown that staggered microvias are as reliable as single stage microvias. It was also decided to have all the microvias plated shut during the copper plating process. Samples were produced as one lot, utilizing FTG's standard manufacturing processes. Efforts were made to include all possible test conditions required to understand microvia reliability....

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Company Information:

Firan Technology Group

FTG is a leading North American manufacturer of high technology printed circuit boards and precision illuminated display systems.

Toronto, Ontario, Canada

Contract Manufacturer, Manufacturer of Assembled PCBs, Service Provider

  • Phone (416) 299 - 4000
  • Fax (416) 292 - 4308

Firan Technology Group website

Company Postings:

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