Impact of Dust on Printed Circuit Assembly Reliability

Published:

March 10, 2021

Author:

Bo Song, Michael H. Azarian and Michael G. Pecht

Abstract:

Atmospheric dust consists of solids suspended in air. Dust is well known for its complex nature. It normally includes inorganic mineral materials, water soluble salts, organic materials, and a small amount of water. The impact of dust on the reliability of printed circuit board assemblies (PCBAs) is ever-growing, driven by the miniaturization of technology and the increasing un-controlled operating conditions with more dust exposure in telecom and information industries....

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Company Information:

CALCE Center for Advanced Life Cycle Engineering

The largest electronic products research center focused on electronics reliability, is dedicated to providing a knowledge and resource base to support the development of competitive electronic components, products and systems.

College Park, Maryland, USA

Service Provider, Training Provider

  • Phone 301-405-5323
  • Fax 301-314-9269

CALCE Center for Advanced Life Cycle Engineering website

Company Postings:

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