• SMTnet
  • »
  • Technical Library
  • »
  • Analyzing the Impact of X-ray Tomography on the Reliability of Integrated Circuits

Analyzing the Impact of X-ray Tomography on the Reliability of Integrated Circuits

Published:

March 18, 2021

Author:

Halit Dogan, Md Mahbub Alam, Navid Asadizanjani, Sina Shahbazmohamadi, Domenic Forte and Mark Tehranipoor

Abstract:

X-ray tomography is a promising technique that can provide micron level, internal structure, and three dimensional (3D) information of an integrated circuit (IC) component without the need for serial sectioning or decapsulation. This is especially useful for counterfeit IC detection as demonstrated by recent work. Although the components remain physically intact during tomography, the effect of radiation on the electrical functionality is not yet fully investigated. In this paper we analyze the impact of X-ray tomography on the reliability of ICs with different fabrication technologies....

  • Download Analyzing the Impact of X-ray Tomography on the Reliability of Integrated Circuits article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

University of Connecticut

The University of Connecticut is a public land-grant research university in Storrs, Connecticut. It was founded in 1881. The primary 4,400-acre campus is in Storrs, Connecticut, approximately a half hour's drive from Hartford and

Storrs, Connecticut, USA

School

  • Phone (860) 486-4900

University of Connecticut website

Company Postings:

(2) technical library articles

  • Feb 20, 2021 - Humitector™ Type 2 Non-Reversible Humidity Indicator Cards from Clariant help assure the integrity of moisture-sensitive surface-mount devices | Clariant Cargo & Device Protection
  • Jan 03, 2021 - Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies | SMTnet
  • Dec 07, 2020 - A Non-destructive Approach to Identify Intermittent Failure Locations on Printed Circuit Cards (PCC) that have been Temperature Cycle Tested | ACI Technologies, Inc.
  • Dec 02, 2020 - SMT007-MIRTEC Intelligent Factory Automation Article-November 2020 | MIRTEC Corp
  • Nov 09, 2020 - Ball Grid Array (BGA) Voiding Affecting Functionality | ACI Technologies, Inc.
  • Browse Technical Library »

Analyzing the Impact of X-ray Tomography on the Reliability of Integrated Circuits article has been viewed 114 times

  • SMTnet
  • »
  • Technical Library
  • »
  • Analyzing the Impact of X-ray Tomography on the Reliability of Integrated Circuits
Fluid Dispense Pump Integration

Dual Lane Reflow Oven