Recommendations for Board Assembly of Infineon Thin Small Discrete Packages without Leads
Published: |
April 1, 2021 |
Author: |
Infineon Technologies AG |
Abstract: |
This document provides information about the Surface Mount Technology (SMT) board assembly of Infineon Thin Small Non-leaded Packages (TSNP). The specific dimensions of the leadframe based inner setup depend on the size of the chip and the type of bonding. The field of application ranges from linear voltage regulators for weight-limited applications such as cellular phones and digital cameras to linear voltage regulators for the automotive sector.... |
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