Operation of a Vacuum Reflow Oven with Void Reduction Data

Published:

April 21, 2021

Author:

Fred Dimock

Abstract:

Voids affect the thermal characteristics and mechanical properties of a solder joint, thereby affecting the reliability of the solder interconnect. The automotive sector in particular is requiring the mitigation of solder voids in various electronic control modules to the minimum possible level. Earlier research efforts performed to decrease voids involved varying the reflow profile, paste deposit, paste alloy composition, stencil aperture, and thickness....

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Company Information:

BTU International

Global supplier of advanced thermal processing equipment and processes to the electronics assembly market.

North Billerica, Massachusetts, USA

Manufacturer of Assembly Equipment

  • Phone 978-667-4111
  • Fax 978-670-2613

BTU International website

Company Postings:

(4) products in the catalog

(5) technical library articles

(279) news releases

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  • Jan 03, 2021 - Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies | SMTnet
  • Dec 07, 2020 - A Non-destructive Approach to Identify Intermittent Failure Locations on Printed Circuit Cards (PCC) that have been Temperature Cycle Tested | ACI Technologies, Inc.
  • Dec 02, 2020 - SMT007-MIRTEC Intelligent Factory Automation Article-November 2020 | MIRTEC Corp
  • Nov 09, 2020 - Ball Grid Array (BGA) Voiding Affecting Functionality | ACI Technologies, Inc.
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