Copper Electroplating Technology for Microvia Filling

Published:

May 26, 2021

Author:

Mark Lefebvre, George Allardyce, Masaru Seita, Hideki Tsuchida, Masaru Kusaka, Shinjiro Hayashi

Abstract:

This paper describes a copper electroplating enabling technology for filling microvias. Driven by the need for faster, smaller and higher performance communication and electronic devices, build-up technology incorporating microvias has emerged as a viable multilayer printed circuit manufacturing technology. Increased wiring density, reduced line widths, smaller through-holes and microvias are all attributes of these High Density Interconnect (HDI) packages. Filling the microvias with conductive material allows the use of stacked vias and via in pad designs thereby facilitating additional packaging density. Other potential design attributes include thermal management enhancement and benefits for high frequency circuitry. Electrodeposited copper can be utilized for filling microvias and provides potential advantages over alternative via plugging techniques. The features, development, scale up and results of direct current (DC) and periodic pulse reverse (PPR) acid copper via filling processes, including chemistry and equipment, are described....

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Company Information:

Rohm and Haas/Advanced Materials

CVD SILICON CARBIDE� from Advanced Materials

Woburn, Massachusetts, USA

Manufacturer of Components

  • Phone 781-933-9243
  • Fax 781-933-5142

Rohm and Haas/Advanced Materials website

Company Postings:

(1) product in the catalog

(1) technical library article

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