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  • An Investigation into Alternative Methods of Drying Moisture Sensitive Devices in Storage and in Re-Workthods will be accompanied by completed independent, unbiased tests conducted by Vinny Nguyen, an engineering student (now graduated) from San Jose S

An Investigation into Alternative Methods of Drying Moisture Sensitive Devices in Storage and in Re-Workthods will be accompanied by completed independent, unbiased tests conducted by Vinny Nguyen, an engineering student (now graduated) from San Jose S

Published:

May 27, 2021

Author:

Vinny Nyugen

Abstract:

The use of desiccant bags filled with Silica Sand and or Clay beads used in conjunction with a Moisture Barrier Bag to control moisture for storage of printed circuit boards has long been an accepted practice and standard from both JEDEC and IPC organizations. Additionally, the use heated ovens for baking off moisture using the evaporation process has also been a long-standing practice from these organizations. This presentation on alternative drying methods will be accompanied by completed independent, unbiased tests conducted by Vinny Nguyen, an engineering student (now graduated) from San Jose State University. The accompanied paper will examine the performance levels of different technologies of desiccant bags to control moisture in enclosed spaces. The tests and equipment set were reviewed by an engineer and consultant to the Lockheed Martin Aerospace Division and the IPC - TM-650 2.6.28 test method was review by engineer from pSemi. The tests were designed to mimic performance tests outlined in Mil Spec 3464, which both IPC and JEDEC have adopted for their respective standards. The test examined variables including absorption capacity rates, weight gain and release of moisture back into the enclosed area. The presentation will also address and highlight: • Similarities of PCBs and Heavy Equipment as it applies to Inspections, Causes of Failure, Types of Corrosion and Moisture Collection Points. • Performance Attributes of Different Desiccant Technologies as it applies to shape, texture, change outs, labeling and regeneration. • Venn Diagram of Electromechanical Failure with the circles 1. Current 2. Contamination 3. Humidity...

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Company Information:

Steel Camel

Super powerful expanding desiccant to keep boards & microelectronics moisture free.... Much different than Silica Sand Beads. Also supplier of corrosion prevention treatments that are alternatives to Conformal coatings.

Tampa, Florida, USA

Other

  • Phone 8138774665

Steel Camel website

Company Postings:

(5) products in the catalog

(2) technical library articles

  • Jun 15, 2021 - Dispensing EMI Shielding Materials: An Alternative to Sputtering | Nordson ASYMTEK
  • Feb 20, 2021 - Humitector™ Type 2 Non-Reversible Humidity Indicator Cards from Clariant help assure the integrity of moisture-sensitive surface-mount devices | Clariant Cargo & Device Protection
  • Jan 03, 2021 - Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies | SMTnet
  • Dec 07, 2020 - A Non-destructive Approach to Identify Intermittent Failure Locations on Printed Circuit Cards (PCC) that have been Temperature Cycle Tested | ACI Technologies, Inc.
  • Dec 02, 2020 - SMT007-MIRTEC Intelligent Factory Automation Article-November 2020 | MIRTEC Corp
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  • An Investigation into Alternative Methods of Drying Moisture Sensitive Devices in Storage and in Re-Workthods will be accompanied by completed independent, unbiased tests conducted by Vinny Nguyen, an engineering student (now graduated) from San Jose S
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