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Design and Experiment of a Solder Paste Jetting System Driven by a Piezoelectric Stack

Published:

June 15, 2021

Author:

Shoudong Gu, Xiaoyang Jiao, Jianfang Liu, Zhigang Yang, Hai Jiang and Qingqing Lv

Abstract:

To compensate for the insufficiency and instability of solder paste dispensing and printing that are used in the SMT (Surface Mount Technology) production process, a noncontact solder paste jetting system driven by a piezoelectric stack based on the principle of the nozzle-needle-system is introduced in this paper, in which a miniscule gap exists between the nozzle and needle during the jetting process. Here, the critical jet ejection velocity is discussed through theoretical analysis. The relations between ejection velocity and needle structure, needle velocity, and nozzle diameter were obtained by FLUENT software. Then, the prototype of the solder paste jetting system was fabricated, and the performance was verified by experiments. The effects of the gap between nozzle and needle, the driving voltage, and the nozzle diameter on the jetting performance and droplet diameter were obtained. Solder paste droplets 0.85 mm in diameter were produced when the gap between the nozzle and needle was adjusted to 10 _m, the driving voltage to 80 V, the nozzle diameter to 0.1 mm, and the variation of the droplet diameter was within _3%....

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Company Information:

Jilin University

Founded in 1946, Jilin University It is a key comprehensive university under the direct jurisdiction of the Ministry of Education, and strongly supported by China’s "Project 211" and "Project 985".

Changchun, China

School

  • Phone +852 69936704

Jilin University website

Company Postings:

(2) technical library articles

  • Jun 28, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
  • Jun 15, 2021 - Dispensing EMI Shielding Materials: An Alternative to Sputtering | Nordson ASYMTEK
  • Feb 20, 2021 - Humitector™ Type 2 Non-Reversible Humidity Indicator Cards from Clariant help assure the integrity of moisture-sensitive surface-mount devices | Clariant Cargo & Device Protection
  • Jan 03, 2021 - Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies | SMTnet
  • Dec 07, 2020 - A Non-destructive Approach to Identify Intermittent Failure Locations on Printed Circuit Cards (PCC) that have been Temperature Cycle Tested | ACI Technologies, Inc.
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