• SMTnet
  • »
  • Technical Library
  • »
  • Effects Of Surface Finish On High Frequency Signal Loss Using Various Substrate Materials

Effects Of Surface Finish On High Frequency Signal Loss Using Various Substrate Materials

Published:

July 6, 2021

Author:

Don Cullen, Bruce Kline, Gary Moderhock, Larry Gatewood

Abstract:

The amount of information transferred on wireless networks has increased dramatically with the tremendous growth of mobile phones, Internet access, and hand held devices. In order to build the infrastructure needed to handle ever increasing data transfer, manufacturers of electronic devices turn to high speed, high frequency electronic signals. The need to render these electronic devices portable is another technology driver. The merge of high-frequency signals with small geometry conductive traces means that the topic of signal loss has reached a critical point in existing device production....

  • Download Effects Of Surface Finish On High Frequency Signal Loss Using Various Substrate Materials article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

MacDermid, Inc.

A global diversified specialty chemicals company focused on providing innovative solutions across several large and growing end-markets that enhance the products of everyday life.

Waterbury, Connecticut, USA

Manufacturer of Assembly Material

  • Phone +1 203.575.5700

MacDermid, Inc. website

Company Postings:

(1) technical library article

  • Jun 28, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
  • Jun 15, 2021 - Dispensing EMI Shielding Materials: An Alternative to Sputtering | Nordson ASYMTEK
  • Feb 20, 2021 - Humitectorâ„¢ Type 2 Non-Reversible Humidity Indicator Cards from Clariant help assure the integrity of moisture-sensitive surface-mount devices | Clariant Cargo & Device Protection
  • Jan 03, 2021 - Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies | SMTnet
  • Dec 07, 2020 - A Non-destructive Approach to Identify Intermittent Failure Locations on Printed Circuit Cards (PCC) that have been Temperature Cycle Tested | ACI Technologies, Inc.
  • Browse Technical Library »

Effects Of Surface Finish On High Frequency Signal Loss Using Various Substrate Materials article has been viewed 98 times

  • SMTnet
  • »
  • Technical Library
  • »
  • Effects Of Surface Finish On High Frequency Signal Loss Using Various Substrate Materials
Flux-Free Reflow Soldering

Electronic Equipment Auctions