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Applying Microscopic Analytic Techniques For Failure Analysis In Electronic Assemblies

Published:

September 21, 2021

Author:

Otto Grosshardt, Boldizsár Árpád Nagy and Anette Laetsch

Abstract:

The present paper gives an overview of surface failures, internal nonconformities and solders joint failures detected by microscopic analysis of electronic assemblies. Optical microscopy (stereomicroscopy) and Fourier-Transform- Infrared (FTIR) microscopy is used for documentation and failure localization on electronic samples surface. For internal observable conditions a metallographic cross-section analysis of the sample is required. The aim of this work is to present some internal and external observable nonconformities which frequently appear in electronic assemblies. In order to detect these nonconformities, optical microscopy, cross section analysis, FTIR-microscopy and scanning electron microscopy with energy dispersive spectrometry (SEM-EDS) were used as analytical techniques....

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Company Information:

ZOLLNER ELECTRONICS, INC.

Headquartered in Germany and founded by Manfred Zollner in 1965, Zollner Elektronik AG has successfully grown to become one of the largest and most formidable Electronic Manufacturing & Engineering Services providers in the world today.

Sterling, Virginia, USA

Contract Manufacturer

  • Phone +1 [703] 344-7410
  • Fax +1 [703] 471-6760

ZOLLNER ELECTRONICS, INC. website

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