Package-on-Package (PoP) for Advanced PCB Manufacturing Process

Published:

December 16, 2021

Author:

Joseph Y. Lee, Jinyong Ahn, JeGwang Yoo, and Shuichi Okabe

Abstract:

In the 1990's, both BGA (Ball Grid Array) and CSP (Chip Size Package) are entering their end in the front-end packaging materials and process technology. Both BGA and CSP like SMD (Surface Mount Device) from the I 980's and THD (Through-Hole mount Device) from the 1970's are reaching its own impasse in terms of maximizing its electrical, mechanical, and thermal performances, size, weight, and reliability....

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Company Information:

Samsung Electro-Mechanics

Samsung Electro-Mechanics produces high-tech integrated components of electronics and mechanical devices for all electrical devices.

SUWON, South Korea

Marketing Agency

  • Phone +82 312182933
  • Fax +82 312105087

Samsung Electro-Mechanics website

Company Postings:

(2) technical library articles

  • Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
  • Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
  • Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
  • Sep 02, 2021 - UV Laser PCB Depaneling Machine Improve Cutting Effect | Winsmart Electronic Co.,Ltd
  • Jun 28, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
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