Package-on-Package (PoP) Warpage Characteristic and Requirement

Published:

December 16, 2021

Author:

Wei Keat Loh, Ron Kulterman, Tim Purdie, Haley Fu, Masahiro Tsuriya

Abstract:

Package-on-Package (PoP) technology is widely used in mobile devices due to its simple design, lower cost and faster time to market. Warpage characteristic and requirement of PoP package becomes critical to ensure both the top and bottom package can be mounted with minimal yield lost. With this challenge in placed, iNEMI has been working relentlessly to fingerprint the current PoP package technology warpage characteristic and to establish some key learning for packaging technologies. The work also extended to understand the basic requirement needed for successful PoP stacking by analyzing the warpage data obtained and formulate a simple analytical equation to explain the true warpage requirement for PoP packaging....

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Company Information:

Intel Corporation

Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.

Santa Clara, California, USA

Manufacturer of Components

  • Phone (408) 765-8080

Intel Corporation website

Company Postings:

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