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Reliability Evaluation of One-Pass and Two-Pass Techniques of Assembly for Package on Packages under Torsion Loads

Published:

December 16, 2021

Author:

Vikram Srinivas, Michael Osterman, Robert Farrell

Abstract:

Package on Packages (PoP) find use in applications that require high performance with increased memory density. One of the greatest benefits of PoP technology is the elimination of the expensive and challenging task of routing high-speed memory lines from under the processor chip out to memory chip in separate packages. Instead, the memory sits on top of the processor and the connections are automatically made during assembly. For this reason PoP technology has gained wide acceptance in cell phones and other mobile applications. PoP technology can be assembled using one-pass and two-pass assembly processes. In the one-pass technique the processor is first mounted to the board, the memory is mounted to the processor and the finished board is then run through the reflow oven in a single pass. The two-pass technique has an intermediate step in which the memory is first mounted onto the processor....

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Company Information:

CALCE Center for Advanced Life Cycle Engineering

The largest electronic products research center focused on electronics reliability, is dedicated to providing a knowledge and resource base to support the development of competitive electronic components, products and systems.

College Park, Maryland, USA

Service Provider, Training Provider

  • Phone 301-405-5323
  • Fax 301-314-9269

CALCE Center for Advanced Life Cycle Engineering website

Company Postings:

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