Reliability of PWB Microvias for High Density Package Assembly

Published:

December 21, 2021

Author:

Reza Ghaffarian, Ph.D.

Abstract:

High density PWB (printed wiring board) with microvia technology is required for implementation of high density and high I/O area array packages (AAP). COTS (commercial off-the-shelf) AAP packaging technologies in high reliability versions with 1.27 mm pitch are now being considered for use in a number of NASA systems including the Space Shuttle and Mars Rovers. NASA functional system designs are requiring ever more denser AAP packages and board features, making board microvia technology very attractive for effectively routing a large number of package inputs/outputs....

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Company Information:

NASA Office Of Safety And Mission Assurance

The Office of Safety and Mission Assurance (OSMA) assures the safety and enhances the success of all NASA activities through the development, implementation and oversight of agencywide safety, reliability, maintainability and ...

Washington, District of Columbia, USA

Research Institute / Laboratory

  • Phone 301-286-6737

NASA Office Of Safety And Mission Assurance website

Company Postings:

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