• SMTnet
  • »
  • Technical Library
  • »
  • Thermal Reliability of Laser Ablated Microvias and Standard Through-Hole Technologies as a Function of Materials and Processing

Thermal Reliability of Laser Ablated Microvias and Standard Through-Hole Technologies as a Function of Materials and Processing

Published:

December 21, 2021

Author:

Todd Young, Frank Polakovic and Michael Carano

Abstract:

High Density Interconnect (HDI) technologies are being used widely in Asia and Europe in consumer electronics for portable wireless communication and computing, digital imaging, and chip packaging. Although North America lags behind in developing process capability for this technology, HDI will become a significant business segment for North America. For this to happen, the printed circuit board shops will have to become process capable in fabricating fine lines and spaces, and also be capable in forming and plating microvias....

  • Download Thermal Reliability of Laser Ablated Microvias and Standard Through-Hole Technologies as a Function of Materials and Processing article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

Isola Group

Isola a global material sciences company focused on designing, developing, manufacturing and marketing copper-clad laminates and dielectric prepregs used to fabricate advanced multilayer PCBs.

Chandler, Arizona, USA

Laminates

  • Phone 480-893-6527
  • Fax 480-893-1409

Isola Group website

Company Postings:

(1) product in the catalog

(4) technical library articles

(19) news releases

  • Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
  • Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
  • Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
  • Sep 02, 2021 - UV Laser PCB Depaneling Machine Improve Cutting Effect | Winsmart Electronic Co.,Ltd
  • Jun 28, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
  • Browse Technical Library »

Thermal Reliability of Laser Ablated Microvias and Standard Through-Hole Technologies as a Function of Materials and Processing article has been viewed 52 times

  • SMTnet
  • »
  • Technical Library
  • »
  • Thermal Reliability of Laser Ablated Microvias and Standard Through-Hole Technologies as a Function of Materials and Processing
Atron DC

IPC Certification Training Schedule