Effect Of Vacuum Reflow On Solder Joint Voiding In Bumped Components

Published:

October 31, 2022

Author:

Arvind Srinivasan Karthikeyan, Sa'd Hamasha, Michael Meilunas, and Fred Dimock

Abstract:

Voids affect the thermal characteristics and mechanical properties of a solder joint, thereby affecting the reliability of the solder interconnect. The automotive sector in particular is requiring the mitigation of solder voids in various electronic control modules to the minimum possible level. Earlier research efforts performed to decrease voids involved varying the reflow profile, paste deposit, paste alloy composition, stencil aperture, and thickness. Due to the various advantages they offer, the use of Ball Grid Array packages is common across all industry sectors. They are also prone to process voiding issues. This study was performed to determine if vacuum assisted reflow process can help alleviate the voids in area array solder joints. Test parameters in this study largely focused on vacuum pressure level and vacuum dwell time....

  • Download Effect Of Vacuum Reflow On Solder Joint Voiding In Bumped Components article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 

Company Information:

Auburn University is a comprehensive land-grant institution with primary missions including instruction, research, and extension/outreach.

Auburn, Alabama, USA

Research Institute / Laboratory / School

  • Phone 334-844-4820
  • Fax 334-844-3307

See Company Website »

Company Postings:

(6) technical library articles

  • Jun 27, 2022 - INTELLI-Pro -- The Future of Automated Optical Inspection | MIRTEC Corp
  • Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
  • Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
  • Sep 02, 2021 - UV Laser PCB Depaneling Machine Improve Cutting Effect | Winsmart Electronic Co.,Ltd
  • Jun 28, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
  • Browse Technical Library »

Effect Of Vacuum Reflow On Solder Joint Voiding In Bumped Components article has been viewed 139 times

SMT feeders

Global manufacturing solutions provider