PCB Quality Metrics that Drive Reliability
Published: |
January 23, 2023 |
Author: |
Bhanu Sood, Ph.D. |
Abstract: |
PDC Outline Section 0: Intro Section 1: What is reliability and root cause? Section 2: Overview of failure mechanisms Section 3: Failure analysis techniques – Non-destructive analysis techniques – Destructive analysis – Materials characterization Section 4: Summary and closure... |
|
|
|
|
|
|
You must be a Company Information:
More articles from NASA Office Of Safety And Mission Assurance »
- Sep 25, 2022 - Cracking Problems in Low-Voltage Chip Ceramic Capacitors
- Dec 21, 2021 - Reliability of PWB Microvias for High Density Package Assembly
- Jul 20, 2021 - Printed Circuit Board Quality: Copper Wrap
- Jul 20, 2021 - A Study on Effects of Copper Wrap Specifications on Printed Circuit Board Reliability
- See all SMT / PCB technical articles from NASA Office Of Safety And Mission Assurance »
More SMT / PCB assembly technical articles »
- Jan 17, 2023 - Introducing Closed-loop Nitrogen Control To Solder Reflow | Heller Industries Inc.
- Jan 17, 2023 - How Challenging Conventional Wisdom Can Optimize Solder Reflow | Heller Industries Inc.
- Jan 17, 2023 - The User Benefits of a Supplier Partnership | Heller Industries Inc.
- Jan 17, 2023 - Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications | Heller Industries Inc.
- Jan 17, 2023 - Flux Management | Heller Industries Inc.
- Browse Technical Library »
PCB Quality Metrics that Drive Reliability article has been viewed 76 times
