The Basics of Package/Device Cooling
Published: |
May 6, 1999 |
Author: |
Christopher Chapman, Aavid Thermal Products, Inc. |
Abstract: |
The most reliable and well-designed electronic device can malfunction or fail if it overheats. Considering thermal issues early in the design process results in a thermally conscious system layout and minimizes costs through the use of passive cooling and off-the-shelf components. When thermal issues are left until completion of the design, the only remaining solution may be a costly custom heat sink that requires all the space available. Incorporating a heat sink or a fan into a product after it is fully developed can be expensive, and still may not provide sufficient cooling of the device. ... |
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