Considerations in Dispensing Conformal Coatings
Published: |
August 27, 1999 |
Author: |
John P. Byers and Christopher E. Havlik |
Abstract: |
Conformal coating is a material that is applied to electronic products or assemblies to protect them from solvents, moisture, dust or other contaminants that may cause harm. Coating also prevents dendrite growth, which may result in product failure. This paper will discuss the variables that affect the application of conformal coatings, and review in detail those variables that impact the process of selective coating of printed circuit boards.... |
|
More articles from Nordson ASYMTEK »
- Feb 26, 2020 - Dispensing EMI Shielding Materials: An Alternative to Sputtering
- Dec 07, 2017 - Utility of Dual Applicators for Non-Atomized Conformal Coating to Improve High-Volume Manufacturing Optimization
- Nov 14, 2013 - Making Sense of Accuracy, Repeatability and Specification for Automated Fluid Dispensing Systems
- Sep 25, 2013 - Conformal Coating Process Characterization Considerations
- Dec 17, 2012 - Throughput vs. Wet-Out Area Study for Package on Package (PoP) Underfill Dispensing
- See all SMT / PCB technical articles from Nordson ASYMTEK
»
More SMT / PCB assembly technical articles »
- Dec 07, 2020 - A Non-destructive Approach to Identify Intermittent Failure Locations on Printed Circuit Cards (PCC) that have been Temperature Cycle Tested | ACI Technologies, Inc.
- Dec 02, 2020 - SMT007-MIRTEC Intelligent Factory Automation Article-November 2020 | MIRTEC Corp
- Nov 09, 2020 - Ball Grid Array (BGA) Voiding Affecting Functionality | ACI Technologies, Inc.
- Nov 04, 2020 - WHY CLEAN A NO-CLEAN FLUX | KYZEN Corporation
- Nov 04, 2020 - Higher Defluxing Temperature and Low Standoff Component Cleaning - A Connection? | ZESTRON Americas
- Browse Technical Library »
Considerations in Dispensing Conformal Coatings article has been viewed 720 times