Dam and Fill Encapsulation for Microelectronic Packages

Published:

August 27, 1999

Author:

Steven J. Adamson and Christian Q. Ness

Abstract:

Contract packaging houses have to contend with a large mix of die types and products. Flexibility and quick turnaround of package types is a must in this industry. Traditional methods of die encapsulation, (i.e., use of transfer-molding techniques), are only cost effective when producing a large number of components. Liquid encapsulants now provide similar levels of reliability1, and are cost effective......

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Company Information:

A leader in automated fluid dispensing, jetting, and conformal coating. Products include stand-alone dispensing workstations and fully automated, in-line conveyorized systems with advanced process controls.

Carlsbad, California, USA

Manufacturer

  • Phone 760-431-1919
  • Fax 760-431-2678

See ASYMTEK Website »

Company Postings:

(26) products in the catalog

(12) technical library articles

(85) news releases

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