Thermal Management of Hybrid Electronic Devices
Published: |
July 21, 1999 |
Author: |
Barry Ritchie, Jamie Serensen |
Abstract: |
Thermal management is a growing challenge in the electronics industry. As the overall size of electronic devices grows smaller, the enclosed electronic assemblies operate at higher frequencies and generate more heat.... |
You must be a registered user to talk back to us. |
Company Information:
More articles from Henkel Electronic Materials »
- Nov 10, 2020 - Printed Electronics for Medical Devices
- Oct 14, 2020 - FRACTURE TOUGHNESS OF THERMALLY CONDUCTIVE ADHESIVES
- Nov 30, 2016 - Understanding the Effect of Process Changes and Flux Chemistry on Mid-Chip Solder Balling
- Mar 10, 2011 - Solder Materials Science Gets Small as Miniaturization Challenges Old Rules
- Sep 23, 2010 - Next Best Thing to a Close Shave: Mitigating the Risks of Tin Whiskers
- See all SMT / PCB technical articles from Henkel Electronic Materials »
More SMT / PCB assembly technical articles »
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 02, 2024 - Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Dec 27, 2023 - Revolutionizing Tech: SMT Auto IC Programming Machine Mastery | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
Thermal Management of Hybrid Electronic Devices article has been viewed 710 times