• SMTnet
  • »
  • Technical Library
  • »
  • Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging

Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging

Published:

August 29, 2013

Author:

Mike Powers, Jianbiao Pan, Julie Silk, Patrick Hyland

Abstract:

Au over Ni on Cu is a widely used printed circuit board (PCB) surface finish, under bump metallization (UBM), and component lead metallization. It is generally accepted that less than 3 wt.% Au in Sn-Pb solder joints inhibits formation of detrimental intermetallic compounds (IMC). However, the critical limit for Au content in Pb-free solder joints is not well established. Three surface-mount package platforms, one with a matte Sn surface finish and the others with Ni/Au finish, were soldered to Ni/Au-finished PCB using Sn-3.0Ag 0.5Cu (SAC305) solder, in a realistic manufacturing setting. The assembled boards were divided into three groups: one without any thermal treatment, one subjected to isothermal aging at 125°C for 30 days, and the third group aged at 125°C for 56 days... ...

  • Download Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

Agilent Technologies, Inc.

World's premier measurement company, providing the critical tools and technologies that sense, measure, and interpret the physical and biological world.

Loveland, Colorado, USA

Manufacturer

  • Phone 1 (800) 829-4444

Agilent Technologies, Inc. website

Company Postings:

(3) products in the catalog

(7) technical library articles

(96) news releases

  • Jun 27, 2022 - INTELLI-Pro -- The Future of Automated Optical Inspection | MIRTEC Corp
  • Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
  • Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
  • Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
  • Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
  • Browse Technical Library »

Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging article has been viewed 647 times

  • SMTnet
  • »
  • Technical Library
  • »
  • Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging
Dual Lane Reflow Oven

IPC Certification Training Schedule IPC Questions and answers