Lead-Free Solder Wafer Bumping

Published:

December 6, 2007

Author:

Fred Dimock, Kristen Mattson.

Abstract:

Over the past 30 years we have learned that lead has negative affects on the health of humans and seen strong legislation remove it from gasoline and paints. More recently, governments in Europe and Asia have set deadlines to remove lead from consumer electronic devices that use printed circuit boards. Currently, the ban is not being applied to high reliability applications such as military or medical devices, but we all know that will come someday soon. Likewise many believe that lead free solder is coming to wafer bump reflow and are beginning to make the transition....

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Company Information:

BTU International

Global supplier of advanced thermal processing equipment and processes to the electronics assembly market.

North Billerica, Massachusetts, USA

Manufacturer of Assembly Equipment

  • Phone 978-667-4111
  • Fax 978-670-2613

BTU International website

Company Postings:

(4) products in the catalog

(4) technical library articles

(273) news releases

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