Lead-Free Solder Wafer Bumping
Published: |
December 6, 2007 |
Author: |
Fred Dimock, Kristen Mattson. |
Abstract: |
Over the past 30 years we have learned that lead has negative affects on the health of humans and seen strong legislation remove it from gasoline and paints. More recently, governments in Europe and Asia have set deadlines to remove lead from consumer electronic devices that use printed circuit boards. Currently, the ban is not being applied to high reliability applications such as military or medical devices, but we all know that will come someday soon. Likewise many believe that lead free solder is coming to wafer bump reflow and are beginning to make the transition.... |
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