Cleaning Flux Residue under Leadless Components using Objective Evidence to Determine Cleaning Performance
Published: |
August 14, 2019 |
Author: |
Mike Bixenman - KYZEN Corporation, Vladimir Sitko, Pavel Hub - PBT Works |
Abstract: |
Cleanliness is a product of design, including component density, standoff height and the cleaning equipment’s ability to deliver the cleaning agent to the source of residue. The presence of manufacturing process soil, such as flux residue, incompletely activated flux, incompletely cured solder masks, debris from handling and processing fixtures, and incomplete removal of cleaning fluids can hinder the functional lifetime of the product. Contaminates trapped under a component are more problematic to failure. Advanced test methods are needed to obtain "objective evidence" for removing flux residues under leadless components. Cleaning process performance is a function of cleaning capacity and defined cleanliness. Cleaning performance can be influenced by the PCB design, cleaning material, cleaning machine, reflow conditions and a wide range of process parameters. This research project is designed to study visual flux residues trapped under the bottom termination of leadless components. This paper will research a non-destructive visual method that can be used to study the cleanability of solder pastes, cleaning material effectiveness for the soil, cleaning machine effectiveness and process parameters needed to render a clean part.... |
You must be a registered user to talk back to us. |
Company Information:
More articles from KYZEN Corporation »
- May 22, 2023 - QUANTIFYING THE IMPROVEMENTS IN THE SOLDER PASTE PRINTING PROCESS FROM STENCIL NANOCOATINGS AND ENGINEERED UNDER WIPE SOLVENTS
- Apr 17, 2023 - The Relationship Between Cleanliness and Reliability/Durability
- Nov 10, 2021 - Stencil Cleaning - A Practical Approach To Improving Yields And Maximizing Your Throughput
- Nov 04, 2020 - WHY CLEAN A NO-CLEAN FLUX
- Jul 27, 2017 - Electrochemical Methods to Measure the Corrosion Potential of Flux Residues
- See all SMT / PCB technical articles from KYZEN Corporation »
More SMT / PCB assembly technical articles »
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 02, 2024 - Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Dec 27, 2023 - Revolutionizing Tech: SMT Auto IC Programming Machine Mastery | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
Cleaning Flux Residue under Leadless Components using Objective Evidence to Determine Cleaning Performance article has been viewed 1186 times