Soldering to Gold Over Nickel Surfaces
Published: |
May 7, 1999 |
Author: |
Dennis Bernier |
Abstract: |
There are many things that can go wrong when soldering to gold plate over nickel surfaces. First of all, we know that gold and solder are not good friends, as any time solder comes into contact with gold, something seems to go wrong. Either the solder bonds to the gold and eventually pulls off as the tin and gold cross-migrate, leaving voids; or the solder completely removes the gold and is expected to bond to the metal which was under the gold.... |
|
|
|
|
|
|
You must be a - Jul 20, 2017 - Reactivity Of No-Clean Flux Residues Trapped Under Bottom Terminated Components
- May 17, 2017 - How to Use the Right Flux for the Selective Soldering Application
- Dec 29, 2016 - Partially-Activated Flux Residue Impacts on Electronic Assembly Reliabilities
- Oct 23, 2012 - Lead-free SMT Soldering Defects How to Prevent Them
- Feb 13, 2009 - SnCu Based Alloy Design for Lower Copper Dissolution and Better Process Control
- See all SMT / PCB technical articles from Kester »
More SMT / PCB assembly technical articles »
- Jun 27, 2022 - INTELLI-Pro -- The Future of Automated Optical Inspection | MIRTEC Corp
- Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
- Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
- Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
- Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
- Browse Technical Library »
Soldering to Gold Over Nickel Surfaces article has been viewed 447 times
