A Novel Solution for No-Clean Flux not Fully Dried under Component Terminations
Published: |
August 17, 2017 |
Author: |
Dr. Ning-Cheng Lee & Fen Chen |
Abstract: |
At SMT assembly, flux outgassing/drying is difficult for devices with poor venting channel, and resulted in insufficiently dried/burnt-off flux residue for no-clean process. Examples including:
|
|
|
|
|
|
|
You must be a Company Information:
More articles from Indium Corporation »
- Oct 11, 2022 - LEAD-FREE FLUX TECHNOLOGY AND INFLUENCE ON CLEANING
- Nov 24, 2020 - The Risk And Solution For No-Clean Flux Not Fully Dried Under Component Terminations the Risk And Solution For No-Clean Flux Not Fully Dried Under Component Terminations
- Jul 24, 2019 - Voiding Performance with Solder Pastes Containing Modified SAC Alloys for Automotive Applications in Bottom Terminated Component Assemblies
- Dec 19, 2018 - Process Optimization for Fine Feature Solder Paste Dispensing
- Nov 20, 2018 - Understanding the Effect of Different Heating Cycles on Post-Soldering Flux Residues and the Impact on Electrical Performance
- See all SMT / PCB technical articles from Indium Corporation »
More SMT / PCB assembly technical articles »
- Jan 17, 2023 - Introducing Closed-loop Nitrogen Control To Solder Reflow | Heller Industries Inc.
- Jan 17, 2023 - How Challenging Conventional Wisdom Can Optimize Solder Reflow | Heller Industries Inc.
- Jan 17, 2023 - The User Benefits of a Supplier Partnership | Heller Industries Inc.
- Jan 17, 2023 - Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications | Heller Industries Inc.
- Jan 17, 2023 - Flux Management | Heller Industries Inc.
- Browse Technical Library »
A Novel Solution for No-Clean Flux not Fully Dried under Component Terminations article has been viewed 932 times
