Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission

Published:

January 3, 2013

Author:

Anurag Bansal, Cherif Guirguis, Kuo-Chuan Liu

Abstract:

Electronics assemblies with large flip-chip BGA packages can be prone to either pad cratering or brittle intermetallic (IMC) failures under excessive PCB bending. Pad cratering cracks are not detected by electrical testing or non-destructive inspection methods, yet they pose a long term reliability risk since the cracks may propagate under subsequent loads to cause electrical failure. Since the initiation of pad cratering does not result in an instantaneous electrical signature, detecting the onset of this failure has been challenging. An acoustic emission methodology was recently developed by the authors to detect the onset of pad cratering. The instantaneous release of elastic energy associated with the initiation of an internal crack, i.e., Acoustic Emission (AE), can be monitored to accurately determine the onset of both pad cratering and brittle intermetallic (IMC) failures....

  • Download Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

Cisco Systems, Inc.

Cisco designs, manufactures, and sells Internet protocol (IP)-based networking and other products related to the communications and IT industry and provide services associated with these products.

San Jose, CA, USA

Manufacturer's Rep

  • Phone 4085264000

Cisco Systems, Inc. website

Company Postings:

(4) technical library articles

(3) news releases

  • Jul 19, 2019 - A Systematic Approach to RoHS Analysis | ACI Technologies, Inc.
  • Jul 11, 2019 - Design of Experimentation for Affordability | ACI Technologies, Inc.
  • Jul 10, 2019 - Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow | Heller Industries Inc.
  • Jul 05, 2019 - Fourier Transform Infrared Spectroscopy | ACI Technologies, Inc.
  • Jul 01, 2019 - Computer Aided Design, Manufacturing, and Engineering | ACI Technologies, Inc.
  • Browse Technical Library »

Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission article has been viewed 209 times

SMT Prototype Stencils - BEST, Inc.

3D solder paste inspection system