Scaling LCA with IPC-175x

Published:

June 7, 2012

Author:

Jørgen Vos, Industry Members (volunteers)

Abstract:

First published in the 2012 IPC APEX EXPO technical conference proceedings. IPC-175x Intent: To establish a standard data exchange format that will facilitate, improve, and secure data transfer between all members of a supply chain. ...

  • Download Scaling LCA with IPC-175x article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

Association Connecting Electronics Industries (IPC)

IPC is the trade association for the printed wiring board and electronics assembly industries.

Bannockburn, Illinois, USA

Association / Non-Profit, Events Organizer, Training Provider

  • Phone 847-615-7100
  • Fax 847-615-7105

Association Connecting Electronics Industries (IPC) website

Company Postings:

(3) products in the catalog

(3) upcoming training courses

(2) technical library articles

(1175) news releases

  • Feb 20, 2021 - Humitector™ Type 2 Non-Reversible Humidity Indicator Cards from Clariant help assure the integrity of moisture-sensitive surface-mount devices | Clariant Cargo & Device Protection
  • Jan 03, 2021 - Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies | SMTnet
  • Dec 07, 2020 - A Non-destructive Approach to Identify Intermittent Failure Locations on Printed Circuit Cards (PCC) that have been Temperature Cycle Tested | ACI Technologies, Inc.
  • Dec 02, 2020 - SMT007-MIRTEC Intelligent Factory Automation Article-November 2020 | MIRTEC Corp
  • Nov 09, 2020 - Ball Grid Array (BGA) Voiding Affecting Functionality | ACI Technologies, Inc.
  • Browse Technical Library »

Scaling LCA with IPC-175x article has been viewed 731 times

Monthly Machinery Auction

Reflow Oven