Lead-free Wave Soldering of Simple to Highly Complex Boards. Process Optimization
Published: |
January 10, 2008 |
Author: |
Denis Barbini, Vitronics Soltec; Paul Wang, Microsoft; Peter Biocca, ITW Kester; Quyen Chu, Jabil |
Abstract: |
This research takes an in-depth look at the challenges encountered in developing a lead free wave soldering process based on the specific products as well as on specific materials. It attempts to provide the reader with the information necessary to make educated decisions in selecting materials and controlling various process parameters in order to execute a rational implementation strategy for a reliable and robust lead free wave soldering process.... |
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