Effective Methods to Get Volatile Compounds Out of Reflow Process

Published:

February 11, 2016

Author:

Gerjan Diepstraten

Abstract:

Although reflow ovens may not have been dramatically changed during the last decade the reflow process changes step by step. With the introduction of lead-free soldering not only operation temperatures increased, but also the chemistry of the solder paste was modified to meet the higher thermal requirements. Miniaturization is a second factor that impacts the reflow process. The density on the assembly is increasing where solder paste deposit volumes decreases due to smaller pad and component dimensions. Pick and place machines can handle more components and to meet this high through put some SMD lines are equipped with dual lane conveyors, doubling solder paste consumption. With the introduction of pin in paste to solder through hole components contamination of the oven increased due to dripping of the paste....

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Company Information:

Global manufacturer of XPM Reflow Ovens, ZEVA Selective Soldering and Delta Wave Soldering Equipment.

Camdenton, Missouri, USA

Manufacturer

  • Phone +1-573-317-3008

See Company Website »

Company Postings:

(7) products in the catalog

(9) technical library articles

(12) news releases

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