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High Frequency Electrical Performance and Thermo-Mechanical Reliability of Fine-Pitch, Copper - Metallized Through-Package-Vias (TPVs) in Ultra - thin Glass Interposers

Published:

August 10, 2017

Author:

Sukhadha Viswanathan, Tomonori Ogawa, Kaya Demir, Timothy B. Huang, P. Markondeya Raj, Fuhan Liu, Venky Sundaram, Rao Tummala

Abstract:

This paper demonstrates the high frequency performance and thermo-mechanical reliability of through vias with 25 μm diameter at 50 μm pitch in 100 μm thin glass substrates. Scaling of through via interconnect diameter and pitch has several electrical performance advantages for high bandwidth 2.5D interposers as well as mm-wave components for 5G modules....

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Company Information:

Center for Board Assembly Research CBAR- advanced research on board assembly processes and systems

Atlanta, Georgia, USA

Research Institute / Laboratory / School

  • Phone 404-385-1053

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