Additively Manufactured mm-Wave Multichip Modules With Fully Printed "Smart" Encapsulation Structures
Published: |
February 9, 2022 |
Author: |
Xuanke He, Bijan K. Tehrani, Ryan Bahr, Wenjing Su, and Manos M. Tentzeris |
Abstract: |
This article presents the first time that an millimeter-wave (mm-wave) multichip module (MCM) with on-demand "smart" encapsulation has been fabricated utilizing additive manufacturing technologies. RF and dc interconnects were fabricated using inkjet printing, while the encapsulation was realized using 3-D printing. Inkjet-printed interconnects feature superior RF performance, better mechanical reliability, and on-demand, low-cost fabrication process.... |
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