DOE for Process Validation Involving Numerous Assembly Materials and Test Methods.
Published: |
March 18, 2010 |
Author: |
Renee Michalkiewicz, Gaylon Morris; Trace Laboratories, Inc., Simin Bagheri; Celestica, Inc. |
Abstract: |
Selecting products that have been qualified by industry standards for use in printed circuit board assembly processes is an accepted best practice. That products which have been qualified, when used in combinations not specifically qualified, may have resultant properties detrimental to assembly function though, is often not adequately understood. Printed circuit boards, solder masks, soldering materials (flux, paste, cored wire, rework flux, paste flux, etc.), adhesives, and inks, when qualified per industry standards, are qualified using very specific test methods which may not adequately mimic the assembly process ultimately used.... |
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