• SMTnet
  • »
  • Technical Library
  • »
  • MECHANICAL FAILURES IN PB-FREE PROCESSING: EVALUATING THE EFFECT OF PAD CRATER DEFECTS ON PROCESS STRAIN LIMITS FOR BGA DEVICES

MECHANICAL FAILURES IN PB-FREE PROCESSING: EVALUATING THE EFFECT OF PAD CRATER DEFECTS ON PROCESS STRAIN LIMITS FOR BGA DEVICES

Published:

October 11, 2022

Author:

John McMahon and Brian Gray

Abstract:

The increased temperatures associated with Pb-free processes have produced significant challenges for PWB laminates. Newly developed laminates have different curing processes, are commonly filled with ceramic particles or micro-clays and can have higher Tg values. These changes which are aimed at improving the materials resistance to thermal excursions and maintaining electrical integrity through primary attach and rework operations have also had the effect of producing harder resin systems with lower fracture toughness....

  • Download MECHANICAL FAILURES IN PB-FREE PROCESSING: EVALUATING THE EFFECT OF PAD CRATER DEFECTS ON PROCESS STRAIN LIMITS FOR BGA DEVICES article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 

Company Information:

A multinational electronics manufacturing services (EMS) company.

Toronto, Ontario, Canada

Manufacturer, Standards Setting / Certification, Training Provider

  • Phone +1 416-448-5800

See Company Website »

Company Postings:

(6) technical library articles

(6) news releases

  • Jan 17, 2023 - Introducing Closed-loop Nitrogen Control To Solder Reflow | Heller Industries Inc.
  • Jan 17, 2023 - How Challenging Conventional Wisdom Can Optimize Solder Reflow | Heller Industries Inc.
  • Jan 17, 2023 - The User Benefits of a Supplier Partnership | Heller Industries Inc.
  • Jan 17, 2023 - Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications | Heller Industries Inc.
  • Jan 17, 2023 - Flux Management | Heller Industries Inc.
  • Browse Technical Library »

MECHANICAL FAILURES IN PB-FREE PROCESSING: EVALUATING THE EFFECT OF PAD CRATER DEFECTS ON PROCESS STRAIN LIMITS FOR BGA DEVICES article has been viewed 137 times

  • SMTnet
  • »
  • Technical Library
  • »
  • MECHANICAL FAILURES IN PB-FREE PROCESSING: EVALUATING THE EFFECT OF PAD CRATER DEFECTS ON PROCESS STRAIN LIMITS FOR BGA DEVICES
Dual Lane Reflow Oven

One stop service for all SMT and PCB needs