MECHANICAL FAILURES IN PB-FREE PROCESSING: EVALUATING THE EFFECT OF PAD CRATER DEFECTS ON PROCESS STRAIN LIMITS FOR BGA DEVICES
Published: |
October 11, 2022 |
Author: |
John McMahon and Brian Gray |
Abstract: |
The increased temperatures associated with Pb-free processes have produced significant challenges for PWB laminates. Newly developed laminates have different curing processes, are commonly filled with ceramic particles or micro-clays and can have higher Tg values. These changes which are aimed at improving the materials resistance to thermal excursions and maintaining electrical integrity through primary attach and rework operations have also had the effect of producing harder resin systems with lower fracture toughness.... |
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