Phase Convection™: The Lead-Free Solution
Published: |
May 30, 2007 |
Author: |
Jean-Jack Boumendil, Pascal Preti. |
Abstract: |
Transition to lead-free is accelerating and when considering constraints related to lead-free and conventional solder pastes, one concern is rising: flexibility. It would be dangerous to commit to lead-free only while the technology is not yet stabilized. Manufacturers need to consider all of the issues related to lead-free and need to find flexible equipment which are able to adapt to both conventional and lead-free constraints.... |
|
|
|
|
|
|
You must be a Company Information:
More articles from Vi TECHNOLOGY »
- Feb 23, 2012 - What is really inside your AOI?
- Jul 15, 2009 - 01005 Assembly, the AOI route to optimizing yield
- See all SMT / PCB technical articles from Vi TECHNOLOGY »
More SMT / PCB assembly technical articles »
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 02, 2024 - Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Dec 27, 2023 - Revolutionizing Tech: SMT Auto IC Programming Machine Mastery | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
Phase Convection™: The Lead-Free Solution article has been viewed 904 times
