Streamlining PCB Assembly and Test NPI with Shared Component Libraries
Published: |
April 8, 2016 |
Author: |
Julian Coates |
Abstract: |
PCB assembly designs become more complex year-on-year, yet early-stage form/fit compliance verification of all designed-in components to the intended manufacturing processes remains a challenge. So long as librarians at the design and manufacturing levels continue to maintain their own local standards for component representation, there is no common representation in the design-to-manufacturing phase of the product lifecycle that can provide the basis for transfer of manufacturing process rules to the design level. A comprehensive methodology must be implemented for all component types, not just the minority which happen to conform to formal packaging standards, to successfully left-shift assembly and test DFM analysis to the design level and thus compress NPI cycle times.(...) This paper will demonstrate the technological components of the working solution: the logic for deriving repeatable and standardized package and pin classifications from a common source of component physical-model content, the method for associating DFA and DFT rules to those classifications, and the transfer of those rules to separate DFM and NPI analysis tools elsewhere in the design-through-manufacturing chain resulting in a consistent DFM process across multiple design and manufacturing organizations.... |
|
Company Information:
More articles from Mentor Graphics »
- Apr 25, 2018 - Modeling And Optimizing Wire Harness Costs For Variation Complexity
- Feb 07, 2018 - Mixed Voltages And Aluminum Conductors: Assesing New Electrcal Technology
- Feb 01, 2018 - Electronic Does Not Equal Smart: Service Documentation and Brand Quality
- Jan 04, 2018 - IPC-1782 Standard for Traceability Supporting Counterfeit Components
- Apr 06, 2017 - Luceda Photonics Delivers a Silicon Photonics IC Solution in Tanner L-Edit.
- See all SMT / PCB technical articles from Mentor Graphics »
More SMT / PCB assembly technical articles »
- Jan 17, 2023 - Introducing Closed-loop Nitrogen Control To Solder Reflow | Heller Industries Inc.
- Jan 17, 2023 - How Challenging Conventional Wisdom Can Optimize Solder Reflow | Heller Industries Inc.
- Jan 17, 2023 - The User Benefits of a Supplier Partnership | Heller Industries Inc.
- Jan 17, 2023 - Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications | Heller Industries Inc.
- Jan 17, 2023 - Flux Management | Heller Industries Inc.
- Browse Technical Library »
Streamlining PCB Assembly and Test NPI with Shared Component Libraries article has been viewed 698 times