Head-on-Pillow Defect Detection – X-ray Inspection Limitations
Published: |
May 26, 2020 |
Author: |
Lars Bruno and Benny Gustafson |
Abstract: |
Both the number and the variants of Ball Grid Array packages (BGAs) are tending to increase on network Printed Board Assemblies (PBAs)with sizes ranging from a few mm die size Wafer Level Packages (WLPs) with low ball count up to large multi-die System-in-Package (SiP) BGAs with 60-70 mm side lengths and thousands of I/Os.... |
You must be a registered user to talk back to us. |
Company Information:
More articles from Ericsson AB »
- Nov 26, 2019 - Key Technology Choices For Optimal Massive IoT Devices
- Aug 04, 2016 - Evaluation of Under-Stencil Cleaning Papers
- Oct 01, 2015 - Printing of Solder Paste - A Quality Assurance Methodology
- See all SMT / PCB technical articles from Ericsson AB »
More SMT / PCB assembly technical articles »
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 02, 2024 - Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Dec 27, 2023 - Revolutionizing Tech: SMT Auto IC Programming Machine Mastery | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
Head-on-Pillow Defect Detection – X-ray Inspection Limitations article has been viewed 922 times