Head-on-Pillow Defect Detection – X-ray Inspection Limitations

Published:

May 26, 2020

Author:

Lars Bruno and Benny Gustafson

Abstract:

Both the number and the variants of Ball Grid Array packages (BGAs) are tending to increase on network Printed Board Assemblies (PBAs)with sizes ranging from a few mm die size Wafer Level Packages (WLPs) with low ball count up to large multi-die System-in-Package (SiP) BGAs with 60-70 mm side lengths and thousands of I/Os....

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Company Information:

Ericsson AB

Ericsson AB manufactures and markets radio and television communication equipment. The company was formerly known as Ericsson Radio Systems AB. Ericsson AB (Sweden) operates as a subsidiary of Ericsson.

Stockholm, Sweden

Other

  • Phone +46 10 719 00 00

Ericsson AB website

Company Postings:

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