Dam and Fill Encapsulation for Microelectronic Packages

Published:

August 27, 1999

Author:

Steven J. Adamson and Christian Q. Ness

Abstract:

Contract packaging houses have to contend with a large mix of die types and products. Flexibility and quick turnaround of package types is a must in this industry. Traditional methods of die encapsulation, (i.e., use of transfer-molding techniques), are only cost effective when producing a large number of components. Liquid encapsulants now provide similar levels of reliability1, and are cost effective......

  • Download Dam and Fill Encapsulation for Microelectronic Packages article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 

Company Information:

A leader in automated fluid dispensing, jetting, and conformal coating. Products include stand-alone dispensing workstations and fully automated, in-line conveyorized systems with advanced process controls.

Carlsbad, California, USA

Manufacturer

  • Phone 760-431-1919
  • Fax 760-431-2678

See ASYMTEK Website »

Company Postings:

(26) products in the catalog

(12) technical library articles

(85) news releases

  • Jun 27, 2022 - INTELLI-Pro -- The Future of Automated Optical Inspection | MIRTEC Corp
  • Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
  • Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
  • Sep 02, 2021 - UV Laser PCB Depaneling Machine Improve Cutting Effect | Winsmart Electronic Co.,Ltd
  • Jun 28, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
  • Browse Technical Library »

Dam and Fill Encapsulation for Microelectronic Packages article has been viewed 1055 times

MSD Dry Cabinets

2023 IPC Questions and answers