Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow

Published:

July 10, 2019

Author:

M. Barnes, D.W. Lee, D. Heller - Heller Industries, M.Holtzer, T. Cucu - Alpha Assembly Solutions, J. Fudala, J. Renda - MacDermid Enthone Electronic Solutions

Abstract:

Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation....

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Company Information:

Heller Industries Inc.

Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.

Florham Park, New Jersey, USA

Manufacturer of Assembly Equipment, OEM, Soldering

  • Phone 973-377-6800
  • Fax 973-377-3862

Heller Industries Inc. website

Company Postings:

(9) used SMT equipment marketplace items

(9) products in the catalog

(2) technical library articles

(19) news releases

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  • Nov 09, 2020 - Ball Grid Array (BGA) Voiding Affecting Functionality | ACI Technologies, Inc.
  • Nov 04, 2020 - WHY CLEAN A NO-CLEAN FLUX | KYZEN Corporation
  • Nov 04, 2020 - Higher Defluxing Temperature and Low Standoff Component Cleaning - A Connection? | ZESTRON Americas
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