• SMTnet
  • »
  • Technical Library
  • »
  • Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum

Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum

Published:

January 28, 2020

Author:

Heller Industries

Abstract:

This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers....

  • Download Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

Heller Industries Inc.

Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.

Florham Park, New Jersey, USA

Manufacturer

  • Phone 973-377-6800
  • Fax 973-377-3862

Heller Industries Inc. website

Company Postings:

(9) used SMT equipment marketplace items

(9) products in the catalog

(2) technical library articles

(21) news releases

  • Apr 19, 2022 - Scalable Reliability for Consumer Electronics | HZO, Inc.
  • Apr 19, 2022 - Protective Coatings for Non-Invasive Medical Devices for Real-World Reliability | HZO, Inc.
  • Apr 19, 2022 - How to Resolve Smart Meter Reliability Issues with Parylene Conformal Coating | HZO, Inc.
  • Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
  • Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
  • Browse Technical Library »

Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum article has been viewed 852 times

  • SMTnet
  • »
  • Technical Library
  • »
  • Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum
FPC* - Fluid Pressure Control - Dispensing Pump

SMT feeders